Temperature increasing device and temperature increasing method

ABSTRACT

The application provides a temperature increasing device and a temperature increasing method. The temperature increasing device is arranged on a motherboard including at least one system element. The temperature increasing device includes a power supply module and a controller After the power supply module is triggered, the power supply module outputs an enable signal to the system element and the controller, the controller detects whether the system element operates according to a preset power-on action, if the controller determines that the system element does not operate according to the preset power-on action, the controller outputs an electric signal to enable the temperature of the system element to increase, and when the temperature of the system element is increased to an extent that the controller determines that the system element is capable of operating according to the preset power-on action, the controller stops outputting the electric signal.

This non-provisional application claims priority under 35 U.S.C. §119(a) to Patent Application No. 107120833 filed in Taiwan, R.O.C. onJun. 15, 2018, the entire contents of which are hereby incorporated byreference.

BACKGROUND Technical Field

The application relates to a device and a method, in particular to atemperature increasing device and a temperature increasing method.

Related Art

Power-on and operation of electronic devices are often affected byambient temperature. For example, when a computer is in alow-temperature environment, sometimes the computer cannot be powered onnormally, or after being powered on, it cannot start up and operatenormally. Traditionally, in order to enable the computer to worknormally, a winding on a Flexible Printed Circuit (FPC) is used as aheater, and the FPC is bonded to an important part for heating, so as toovercome the effects of the low-temperature environment.

However, in the traditional method, since the FPC is used for heating,the cost of the FPC needs to be additionally increased and the heatingefficiency still needs to be improved.

SUMMARY

The application provides a temperature increasing system and method inorder to improve the problems in the prior art.

In one embodiment of the application, a temperature increasing deviceprovided by the application is arranged on a motherboard including atleast one system element. The temperature increasing device includes apower supply module and a controller, the power supply module iselectrically connected to the at least one system element, and thecontroller is electrically connected to the at least one system elementand the power supply module. After the power supply module is triggered,the power supply module outputs an enable signal to the at least onesystem element and the controller, the controller detects whether the atleast one system element operates according to a preset power-on action,if the controller determines that the at least one system element doesnot operate according to the preset power-on action, the controlleroutputs an electric signal to increase the temperature of the at leastone system element, and when the temperature of the at least one systemelement is increased to an extent that the controller determines thatthe at least one system element is capable of operating according to thepreset power-on action, the controller stops outputting the electricsignal.

In one embodiment of the application, the power supply module includes apower supply switch and a power supply element, and when the powersupply switch is triggered, the power supply element outputs the enablesignal to the at least one system element and the controller.

In one embodiment of the application, the motherboard further includes aplurality of peripheral elements located around the at least one systemelement, and after the power supply element outputs the enable signal tothe at least one system element, if the at least one system element doesnot send a feedback signal to the controller, the controller determinesthat the at least one system element does not operate according to thepreset power-on action.

In one embodiment of the application, when the controller determinesthat the at least one system element does not operate according to thepreset power-on action, the controller outputs the electric signal tothe power supply element at a frequency such that the power supplyelement repeatedly provides the enable signal and a disable signal tothe system element, so that the at least one system element alternatelyperforms the preset power-on action and a power-off action such that thetemperature of the at least one system element and the peripheralelements is increased, and till the at least one system element sendsthe feedback signal to the controller, the controller determines thatthe at least one system element is capable of operating according to thepreset power-on action and the controller stops outputting the electricsignal.

In one embodiment of the application, when the controller determinesthat the at least one system element does not operate according to thepreset power-on action, the controller outputs the electric signal tothe power supply element such that the power supply element continuouslyprovides the enable signal to the at least one system element, so thatthe at least one system element continuously restarts the presetpower-on action such that the temperature of the at least one systemelement and the peripheral elements is increased, and till the at leastone system element sends the feedback signal to the controller, thecontroller determines that the at least one system element is capable ofoperating according to the preset power-on action and the controllerstops outputting the electric signal.

In one embodiment of the application, the at least one system elementincludes at least one of a central processing unit and a hard disk.

In one embodiment of the application, the temperature increasing deviceincludes a heating module and a temperature sensor. The heating moduleis arranged on the motherboard and electrically connected to thecontroller, and the temperature sensor is electrically connected to thecontroller and used for sensing the temperature of the at least onesystem element. If the controller determines that the temperature islower than predetermined temperature such that the system element doesnot operate according to the preset power-on action, the controlleroutputs the electric signal to the heating module such that the heatingmodule heats the at least one system element to increase thetemperature, and till the controller determines that the temperature ishigher than the predetermined temperature such that the at least onesystem element is capable of operating according to the preset power-onaction, the controller stops outputting the electric signal to theheating module.

In one embodiment of the application, the heating module includes aheating wire and a power supply part. The heating wire surrounds atleast one system element, and the power supply part is electricallyconnected to the heating wire and the controller. If the controllerdetermines that the temperature is lower than the predeterminedtemperature such that the at least one system element does not operateaccording to the preset power-on action, the controller outputs theelectric signal to the power supply part, so that the power supply partsupplies power to the heating wire to increase the temperature of theheating wire and the at least one system element is heated to increasethe temperature through the heating wire with temperature which has beenincreased, and till the controller determines that the temperature ishigher than the predetermined temperature such that the at least onesystem element is capable of operating according to the preset power-onaction, the controller stops outputting the electric signal to the powersupply part.

In one embodiment of the application, the heating module includes ametal part and a power supply part. The metal part is arranged on themotherboard and jointed to the at least one system element, and thepower supply part is electrically connected to the metal part and thecontroller. If the controller determines that the temperature is lowerthan the predetermined temperature such that the at least one systemelement does not operate according to the preset power-on action, thecontroller outputs the electric signal to the power supply part, so thatthe power supply part provides current for the metal part to increasethe temperature of the metal part and the at least one system element isheated to increase the temperature through the metal part withtemperature which has been increased, and till the controller determinesthat the temperature is higher than the predetermined temperature suchthat the at least one system element is capable of operating accordingto the preset power-on action, the controller stops outputting theelectric signal to the power supply part.

In one embodiment of the application, the power supply part is afixed-current source and the current is constant current.

In one embodiment of the application, a temperature increasing methodprovided by the application is applicable to a motherboard including atleast one system element electrically connected to a power supplymodule. The temperature increasing method includes the following steps:after the power supply module is triggered, the power supply moduleoutputting an enable signal to the at least one system element;detecting whether the at least one system element operates according toa preset power-on action; if it is determined that the at least onesystem element does not operate according to the preset power-on action,outputting an electric signal to increase the temperature of the atleast one system element; and when the temperature of the at least onesystem element is increased to an extent that the at least one systemelement is capable of operating according to the preset power-on action,stopping outputting the electric signal.

To sum up, the technical solution of the application has obviousadvantages and beneficial effects compared with the prior art. By meansof the technical solution of the application, a completely novel heatingmethod is provided, no FPC is used and the heating efficiency is good.

The application will be described below in detail in the followingembodiments, and further explanation will be provided for the technicalsolution of the application.

BRIEF DESCRIPTION OF THE DRAWINGS

In order to make the above-mentioned and other purposes, features,advantages and embodiments of the application be more obvious andunderstandable, the accompanying drawings will be described as follows:

FIG. 1 illustrates a schematic view of a temperature increasing deviceaccording to one embodiment of the application.

FIG. 2 illustrates a schematic view of a temperature increasing deviceaccording to another embodiment of the application.

FIG. 3 illustrates a schematic view of a temperature increasing deviceaccording to another embodiment of the application. And

FIG. 4 illustrates a flowchart of a temperature increasing methodaccording to one embodiment of the application.

DETAILED DESCRIPTION OF THE EMBODIMENTS

In order to make the description of the application be more detailed andcomplete, reference may be made to the accompanying drawings and thevarious embodiments described below, and the same number in the drawingsrepresents the same or similar element. On the other hand, well-knownelements and steps are not described in the embodiments to avoidunnecessary limitations to the application.

In the scope of the embodiments and the application for patent, thedescription related to “connect” generally refers to the indirectcoupling of one element to another through other elements, or the directconnection of one element to another without any other elements.

In the scope of the embodiments and the application for patent, unlessthere are special restrictions on articles herein, “one” and “the” cangenerally refer to one or more.

FIG. 1 illustrates a schematic view of a temperature increasing deviceaccording to one embodiment of the application. As illustrated in FIG.1, the temperature increasing device is arranged on a motherboard 100including at least one system element 101. In the present embodiment,description is made by taking one system element as an example. Thetemperature increasing device includes a power supply module 110 and acontroller 120. Structurally, the power supply module 110 iselectrically connected to the system element 101, and the controller 120is electrically connected to the system element 101 and the power supplymodule 110. For example, the controller 120 may be a microcontroller, anembedded controller, or other circuit element capable of providing thesame function.

In FIG. 1, the power supply module 110 includes a power supply switch111 and a power supply element 112. Structurally, the power supplyswitch 111 is electrically connected to the power supply element 112,and the power supply element 112 is electrically connected to the systemelement 101 and the controller 120. For example, the power supplyelement 112 may be a power switching chip, which may include a DC-DCconverter for converting external DC voltage into DC voltage applicableto the system element 101, wherein the external power may be directcurrent converted by an AC-DC converter from commercial power or directcurrent supplied by a battery.

During operation, if a user triggers the power supply switch 111, thepower supply module 110 is triggered and the power supply element 112outputs an enable signal to the system element 101 and the controller120.

After the power supply module 110 is triggered, the power supply module110 outputs an enable signal to the system element 101 and thecontroller 120, the controller 120 detects whether the system element101 operates according to a preset power-on action, if the controller120 determines that the system element 101 does not operate according tothe preset power-on action, the controller 120 outputs an electricsignal to increase the temperature of the system element 101, and whenthe temperature of the system element 101 is increased to an extent thatthe controller 120 determines that the system element 101 is capable ofoperating according to the preset power-on action, the controller 120stops outputting the electric signal. Then, the system element 101 iscapable of normally performing the complete power-on action.

Specifically, the motherboard 100 further includes a plurality ofperipheral elements 102 located around the system element 101. Forexample, the system element 101 may be any primary element such as acentral processing unit and a hard disk (e.g., a solid state hard disk),the peripheral elements 102 may be any secondary elements such asresistors, capacitors and inductors. After the power supply element 112outputs the enable signal to the system element 101, if the systemelement 101 does not send a feedback signal to the controller 120, itrepresents that the temperature of the system element 101 is too low tooperate normally (i.e., loses the ability to send signals), thecontroller 120 determines that the system element 101 does not operateaccording to the preset power-on action.

In one embodiment of the application, the preset power-on action is thenormal power-on action. For example, the primary element such as thesystem element 101, such as the central processing unit or the harddisk, after the power supply element 112 outputs the enable signal tothe system element 101, performs the preset power-on action, and therebythe feedback signal can be output through the ability of the systemelement 101 to send signals, and then is loaded into an operating systemto complete the routine power-on operation.

When the controller 120 determines that the system element 101 does notoperate according to the preset power-on action, the controller 120outputs the electric signal to the power supply element 112 at afrequency, wherein the frequency may be a preset frequency (e.g.,regular frequency, variable frequency or adjustable frequency), suchthat the power supply element 112 repeatedly provides the enable signaland a disable signal for the system element 101, so that the systemelement 101 alternately performs the preset power-on action and apower-off action such that the temperature of the system element 101 andthe peripheral elements 102 is increased, wherein the increase of thetemperature of the peripheral elements 102 facilitates the accelerationof the increase of the temperature of the system element 101, and tillthe system element 101 sends the feedback signal to the controller 120,since the system element 101 has the ability to send signals, whichrepresents that the system element 101 has been capable of operatingnormally, the controller 120 determines that the system element 101 iscapable of operating according to the preset power-on action and thecontroller 120 stops outputting the electric signal. Then, the systemelement 101 is capable of normally performing the complete power-onaction.

It should be understood that the above-mentioned regular frequency is afrequency reflecting alternation of the preset power-on action and thepower-off action, and the actual number and predetermined duration maybe set flexibly by a system designer based on practical experience.

Or, when the controller 120 determines that the system element 101 doesnot operate according to the preset power-on action, the controller 120outputs the electric signal to the power supply element 112 such thatthe power supply element 112 continuously provides the enable signal forthe system element 101, so that the system element 101 continuouslyrestarts the preset power-on action such that the temperature of thesystem element 101 and the peripheral elements 102 is increased, andtill the system element 101 sends the feedback signal to the controller120, since the system element 101 has the ability to send signals, whichrepresents that the system element 101 has been capable of operatingnormally, the controller 120 determines that the system element 101 iscapable of operating according to the preset power-on action and thecontroller 120 stops outputting the electric signal. Then, the systemelement 101 is capable of normally performing the complete power-onaction.

FIG. 2 illustrates a schematic view of a temperature increasing deviceaccording to another embodiment of the application. It should beunderstood that the same elements or similar operations in FIG. 2 asillustrated in FIG. 1 will not be repetitively described in the presentembodiment.

As illustrated in FIG. 2, the motherboard 100 includes a system element101. In addition to the power supply module 110 and the controller 120,the temperature increasing device further includes a heating module 210and a temperature sensor 220, and the power supply module 110 alsoincludes a power supply switch 111 and a power supply element 112.Structurally, the heating module 210 is arranged on the motherboard 100and electrically connected to the controller 120, the controller 120 iselectrically connected to the temperature sensor 220, the temperaturesensor 220 is arranged on the motherboard 100 and adjacent to the systemelement 101, and after the power supply module 110 is triggered, thetemperature sensor 220 is used for sensing the temperature of the systemelement 101.

If the controller 120 determines that the temperature of the systemelement 101 is lower than predetermined temperature such that the systemelement 101 does not operate according to the preset power-on action, itrepresents that the temperature of the system element 101 is too low torealize normal power-on, the controller 120 outputs the electric signalto the heating module 210 such that the heating module 210 heats thesystem element 101 to increase the temperature, and till the controller120 determines that the temperature is higher than the predeterminedtemperature such that the system element is capable of operatingaccording to the preset power-on action, the controller 120 stopsoutputting the electric signal to the heating module 210. Then, thesystem element 101 is capable of normally performing the completepower-on action.

In FIG. 2, the heating module 210 includes a heating wire 211 and apower supply part 212. Structurally, the heating wire 211 surrounds thesystem element 101, and the power supply part 212 is electricallyconnected to the heating wire 211, the controller 120 and the powersupply module 110. For example, the heating wire 211 (e.g., metal wire)may be embedded in the motherboard 100 to uniformly heat and save space.

During operation, the temperature sensor 220 senses the temperature ofthe system element 101. If the controller 120 determines that thetemperature of the system element 101 is lower than the predeterminedtemperature such that the system element 101 does not operate accordingto the preset power-on action, it represents that the temperature of thesystem element 101 is too low to realize normal power-on, the controller120 outputs the electric signal to the power supply part 212, so thatthe power supply part 212 supplies power to the heating wire 211 toincrease the temperature of the heating wire and the system element 101is heated to increase the temperature through the heating wire 211 withtemperature which has been increased, and till the controller 120determines that the temperature of the system element 101 is higher thanthe predetermined temperature such that the system element 101 iscapable of operating according to the preset power-on action, thecontroller 120 stops outputting the electric signal to the power supplypart 212 such that the power supply part 212 is turned off. Then, thesystem element 101 is capable of normally performing the completepower-on action.

FIG. 3 illustrates a schematic view of a temperature increasing deviceaccording to another embodiment of the application. It should beunderstood that the same elements or similar operations in FIG. 3 asillustrated in FIG. 1 and FIG. 2 will not be repetitively described inthe present embodiment.

As illustrated in FIG. 3, the motherboard 100 includes a system element101. In addition to the power supply module 110 and the controller 120,the temperature increasing device includes a heating module 310 and atemperature sensor 220, and the power supply module 110 also includes apower supply switch 111 and a power supply element 112. Structurally,the heating module 310 is arranged on the motherboard 100 andelectrically connected to the controller 120, and the heating module 310includes a metal part 311 and a power supply part 312. Structurally, themetal part 311 is arranged on the motherboard 100 and jointed to thesystem element 101, and the power supply part 312 is electricallyconnected to the metal part 311, the controller 120 and the power supplymodule 110. For example, the metal part 311 may be a metal radiator,such as cooling fins.

It should be understood that, after the normal power-on, since thesystem element 101 (e.g., the central processing unit) will generate alot of heat during normal operation, by jointing the metal part 311 tothe system element 101, the cooling of the system element 101 duringoperation is facilitated and the failure is avoided.

If the controller 120 determines that the temperature of the systemelement 101 is lower than the predetermined temperature such that thesystem element 101 does not operate according to the preset power-onaction, it represents that the temperature of the system element 101 istoo low to realize normal power-on, the controller 120 outputs theelectric signal to the power supply part 312, so that the power supplypart 312 supplies current to the metal part 311 to increase thetemperature of the metal part 311 and the system element 101 is heatedto increase the temperature through the metal part 311 with temperaturewhich has been increased, and till the controller 120 determines thatthe temperature of the system element 101 is higher than thepredetermined temperature such that the system element 101 is capable ofoperating according to the preset power-on action, the controller 120stops outputting the electric signal to the power supply part 312 suchthat the power supply part 312 is turned off. Then, the system element101 is capable of normally performing the complete power-on action.

In one embodiment of the application, since the resistance of the metalpart 311 is much larger than that of the heating wire 211, in order toensure that the metal part 311 can receive enough current and generateheat, the power supply part 312 is a fixed-current source. No matter howlarge the resistance of the connected metal part 311 is, it can provideconstant current for the metal part 311, such that the metal part 311can be stably heated to increase the temperature.

In order to further describe the operating method of the above-mentionedtemperature increasing device, please refer to FIGS. 1 to 4, whereinFIG. 4 illustrates a flowchart of a temperature increasing method 400according to one embodiment of the application. As illustrated in FIG.4, the temperature increasing method 400 includes steps S401, S402, andS403 (it should be understood that the steps mentioned in the presentembodiment may be adjusted in terms of sequence according to the actualneeds, or even performed simultaneously or partially, unless the orderis specially stated).

In step S401, after the power supply module 110 is triggered, the powersupply module 110 outputs an enable signal to the system element 101; instep S402, whether the system element 101 operates according to a presetpower-on action is detected; if it is determined that the system element101 does not operate according to the preset power-on action, anelectric signal is output to increase the temperature of the systemelement 101; and in step S403, when the temperature of the systemelement 101 is increased to an extent that the system element 101 iscapable of operating according to the preset power-on action, outputtingthe electric signal is stopped. Then, the system element 101 is capableof normally performing the complete power-on action.

Please refer to FIGS. 1 and 4 at the same time. Specifically, the powersupply module 110 includes a power supply switch 111 and a power supplyelement 112. In step S401, when the power supply switch 111 istriggered, the power supply element 112 outputs the enable signal to thesystem element 101. After the power supply module outputs the enablesignal to the system element 101, if the system element 101 (e.g.,central processing unit and/or hard disk) does not send a feedbacksignal, then in step S402, it is determined that the system element 101does not operate according to the preset power-on action. When thesystem element 101 does not operate according to the preset power-onaction, the electric signal is output to the power supply element 112 ata frequency such that the power supply element 112 repeatedly providesthe enable signal and a disable signal for the system element 101, sothat the system element 101 alternately performs the preset power-onaction and a power-off action such that the temperature of the systemelement 101 and the peripheral elements 102 is increased. Or, in stepS402, when the system element 101 does not operate according to thepreset power-on action, the power supply element 112 continuouslyprovides the enable signal for the system element 101, and thereby thesystem element 101 continuously restarts the preset power-on action suchthat the temperature of the system element 101 and the peripheralelements 102 is increased. Then, in step S403, when the system element101 sends the feedback signal, it is determined that the temperature ofthe system element 101 is increased to an extent that the system element101 is capable of operating according to the preset power-on action tostop outputting the electric signal according to the feedback signal.Then, the system element 101 is capable of normally performing thecomplete power-on action.

Or, please refer to FIGS. 2 and 4 at the same time. In step S401, thetemperature of the system element 101 is sensed; in step S402, if it isdetermined that the temperature of the system element 101 is lower thanpredetermined temperature such that the system element 101 does notoperate according to the preset power-on action, the electric signal isoutput to the heating module 210 such that the heating module 210 heatsthe system element 101 to increase the temperature, and till in stepS403 it is determined that the temperature of the system element 101 ishigher than the predetermined temperature such that the system element101 is capable of operating according to the preset power-on action,outputting the electric signal to the heating module 210 is stopped.

Specifically, the heating module 210 includes a heating wire 211 and apower supply part 212. In step S402, if it is determined that thetemperature of the system element 101 is lower than the predeterminedtemperature such the system element 101 does not operate according tothe preset power-on action, the electric signal is output to the powersupply part 212, so that the power supply part 212 supplies power to theheating wire 211 to increase the temperature of the heating wire 211 andthe system element 101 is heated to increase the temperature through theheating wire 211 with temperature which has been increased, and till instep S403 it is determined that the temperature of the system element101 is higher than the predetermined temperature such that the systemelement 101 is capable of operating according to the preset power-onaction, outputting the electric signal to the power supply part 212 isstopped.

Or, please refer to FIGS. 3 and 4 at the same time. In step S401, thetemperature of the system element 101 is sensed. In step S402, if it isdetermined that the temperature of the system element 101 is lower thanpredetermined temperature such that the system element 101 does notoperate according to the preset power-on action, the electric signal isoutput such that the heating module 310 heats the system element 101 toincrease the temperature, and till in step S403 it is determined thatthe temperature of the system element 101 is higher than thepredetermined temperature such that the system element 101 is capable ofoperating according to the preset power-on action, outputting theelectric signal to the heating module 310 is stopped.

Specifically, the heating module includes a metal part 311 and a powersupply part 312. In step S401, if it is determined that the temperatureof the system element 101 is lower than the predetermined temperaturesuch that the system element 101 does not operate according to thepreset power-on action, the electric signal is output to the powersupply part 312, so that the power supply part 312 supplies current tothe metal part 311 to increase the temperature of the metal part 311 andthe system element 101 is heated through the metal part 311 withtemperature which has been increased, and till it is determined that thetemperature of the system element 101 is higher than the predeterminedtemperature such that the system element 101 is capable of operatingaccording to the preset power-on action, outputting the electric signalto the power supply part 312 is stopped. In one embodiment of theapplication, the power supply part 312 is a fixed-current source and thecurrent is constant current.

To sum up, the technical solution of the application has obviousadvantages and beneficial effects compared with the prior art. By meansof the technical solution of the application, a completely novel heatingmethod is provided, no FPC is used and the heating efficiency is good.

Although the application has been disclosed as above in the form ofembodiments, it is not intended to limit the application. One skilled inthe art may make various changes and modifications without departingfrom the spirit and scope of the application. Therefore, the protectionscope of the application shall be determined by the claims attachedthereto.

What is claimed is:
 1. A temperature increasing device arranged on amotherboard including at least one system element, the temperatureincreasing device comprising: a power supply module electricallyconnected to the at least one system element; and a controllerelectrically connected to the at least one system element and the powersupply module, wherein after the power supply module is triggered, thepower supply module outputs an enable signal to the at least one systemelement and the controller, the controller detects whether the at leastone system element operates according to a preset power-on action, ifthe controller determines that the at least one system element does notoperate according to the preset power-on action, the controller outputsan electric signal to increase the temperature of the at least onesystem element, and when the temperature of the at least one systemelement is increased to an extent that the controller determines thatthe at least one system element is capable of operating according to thepreset power-on action, the controller stops outputting the electricsignal.
 2. The temperature increasing device according to claim 1,wherein the power supply module comprises a power supply switch and apower supply element, and when the power supply switch is triggered, thepower supply element outputs the enable signal to the at least onesystem element and the controller.
 3. The temperature increasing deviceaccording to claim 2, wherein the motherboard further comprises aplurality of peripheral elements located around the at least one systemelement, and after the power supply element outputs the enable signal tothe at least one system element, if the at least one system element doesnot send a feedback signal to the controller, the controller determinesthat the at least one system element does not operate according to thepreset power-on action.
 4. The temperature increasing device accordingto claim 3, wherein when the controller determines that the at least onesystem element does not operate according to the preset power-on action,the controller outputs the electric signal to the power supply elementat a frequency such that the power supply element repeatedly providesthe enable signal and a disable signal to the at least one systemelement, so that the at least one system element alternately performsthe preset power-on action and a power-off action such that thetemperature of the at least one system element and the peripheralelements is increased, and till the at least one system element sendsthe feedback signal to the controller, the controller determines thatthe at least one system element is capable of operating according to thepreset power-on action and the controller stops outputting the electricsignal.
 5. The temperature increasing device according to claim 3,wherein when the controller determines that the at least one systemelement does not operate according to the preset power-on action, thecontroller outputs the electric signal to the power supply element suchthat the power supply element continuously provides the enable signal tothe at least one system element, so that the at least one system elementcontinuously restarts the preset power-on action such that thetemperature of the at least one system element and the peripheralelements is increased, and till the at least one system element sendsthe feedback signal to the controller, the controller determines thatthe at least one system element is capable of operating according to thepreset power-on action and the controller stops outputting the electricsignal.
 6. The temperature increasing device according to claim 3,wherein the at least one system element comprises at least one of acentral processing unit and a hard disk.
 7. The temperature increasingdevice according to claim 1, wherein the temperature increasing devicecomprises: a heating module arranged on the motherboard and electricallyconnected to the controller; and a temperature sensor electricallyconnected to the controller to sense the temperature of the at least onesystem element, if the controller determines that the temperature islower than predetermined temperature such that the at least one systemelement does not operate according to the preset power-on action, thecontroller outputs the electric signal to the heating module such thatthe heating module heats the at least one system element to increase thetemperature, and till the controller determines that the temperature ishigher than the predetermined temperature such that the at least onesystem element is capable of operating according to the preset power-onaction, the controller stops outputting the electric signal to theheating module.
 8. The temperature increasing device according to claim7, wherein the heating module comprises: a heating wire surrounding theat least one system element; and a power supply part electricallyconnected to the heating wire and the controller, if the controllerdetermines that the temperature is lower than the predeterminedtemperature such that the at least one system element does not operateaccording to the preset power-on action, the controller outputs theelectric signal to the power supply part, so that the power supply partsupplies power to the heating wire to increase the temperature of theheating wire and the at least one system element is heated to increasethe temperature through the heating wire with temperature which has beenincreased, and till the controller determines that the temperature ishigher than the predetermined temperature such that the at least onesystem element is capable of operating according to the preset power-onaction, the controller stops outputting the electric signal to the powersupply part.
 9. The temperature increasing device according to claim 7,wherein the heating module comprises: a metal part arranged on themotherboard and jointed to the at least one system element; and a powersupply part electrically connected to the metal part and the controller,if the controller determines that the temperature is lower than thepredetermined temperature such that the at least one system element doesnot operate according to the preset power-on action, the controlleroutputs the electric signal to the power supply part, so that the powersupply part provides current for the metal part to increase thetemperature of the metal part and the at least one system element isheated to increase the temperature through the metal part withtemperature which has been increased, and till the controller determinesthat the temperature is higher than the predetermined temperature suchthat the at least one system element is capable of operating accordingto the preset power-on action, the controller stops outputting theelectric signal to the power supply part.
 10. The temperature increasingdevice according to claim 9, wherein the power supply part is afixed-current source and the current is constant current.
 11. Atemperature increasing method applicable to a motherboard including atleast one system element electrically connected to a power supplymodule, the temperature increasing method comprising the followingsteps: after the power supply module is triggered, the power supplymodule outputting an enable signal to the at least one system element;detecting whether the at least one system element operates according toa preset power-on action; if the at least one system element does notoperate according to the preset power-on action, outputting an electricsignal to increase the temperature of the at least one system element;and when the temperature of the at least one system element is increasedto an extent that the at least one system element is capable ofoperating according to the preset power-on action, stopping outputtingthe electric signal.
 12. The temperature increasing method according toclaim 11, wherein the power supply module comprises a power supplyswitch and a power supply element, wherein after the power supply moduleis triggered, the step further comprises: when the power supply switchis triggered, the power supply element outputting the enable signal tothe at least one system element.
 13. The temperature increasing methodaccording to claim 12, wherein the system element further comprises aplurality of peripheral elements located around the at least one systemelement, wherein after the power supply element outputs the enablesignal to the at least one system element, the step further comprises:if the at least one system element does not send a feedback signal,determining that the at least one system element does not operateaccording to the preset power-on action.
 14. The temperature increasingmethod according to claim 13, wherein, the step of, if the at least onesystem element does not operate according to the preset power-on action,outputting an electric signal to increase the temperature of the atleast one system element, and when the temperature of the at least onesystem element is increased to an extent that the at least one systemelement is capable of operating according to the preset power-on action,stopping outputting the electric signal, further comprises: outputtingthe electric signal to the power supply element at a frequency such thatthe power supply element repeatedly provides the enable signal and adisable signal to the at least one system element, so that the at leastone system element alternately performs the preset power-on action and apower-off action such that the temperature of the at least one systemelement and the peripheral elements is increased, and till the at leastone system element sends the feedback signal, determining that the atleast one system element is capable of operating according to the presetpower-on action, and accordingly stop outputting the electric signal.15. The temperature increasing method according to claim 13, wherein,the step of, if the at least one system element does not operateaccording to the preset power-on action, outputting an electric signalto increase the temperature of the at least one system element, and whenthe temperature of the at least one system element is increased to anextent that the at least one system element is capable of operatingaccording to the preset power-on action, stopping outputting theelectric signal, further comprises: the power supply elementcontinuously providing the enable signal to the at least one systemelement, so that the at least one system element continuously restartsthe preset power-on action such that the temperature of the at least onesystem element and the peripheral elements is increased, and till the atleast one system element sends the feedback signal, determining that theat least one system element is capable of operating according to thepreset power-on action, and accordingly stop outputting the electricsignal.
 16. The temperature increasing method according to claim 13,wherein the at least one system element comprises at least one of acentral processing unit and a hard disk.
 17. The temperature increasingmethod according to claim 11, wherein a heating module is furthercomprised and arranged on the motherboard, and the step of, if the atleast one system element does not operate according to the presetpower-on action, outputting the electric signal to increase thetemperature of the at least one system element, and when the temperatureof the at least one system element is increased to an extent that the atleast one system element is capable of operating according to the presetpower-on action, stopping outputting the electric signal, furthercomprises: sensing the temperature of the at least one system element,if the temperature is lower than predetermined temperature such that theat least one system element does not operate according to the presetpower-on action, outputting the electric signal to the heating modulesuch that the heating module heats the at least one system element toincrease the temperature, and till that the temperature is higher thanthe predetermined temperature such that the at least one system elementis capable of operating according to the preset power-on action,stopping outputting the electric signal to the heating module.
 18. Thetemperature increasing method according to claim 17, wherein the heatingmodule comprises a heating wire and a power supply part, the heatingwire surrounds the at least one system element, the power supply part iselectrically connected to the heating wire, and the step of, if the atleast one system element does not operate according to the presetpower-on action, outputting the electric signal to increase thetemperature of the at least one system element, and when the temperatureof the at least one system element is increased to an extent that the atleast one system element is capable of operating according to the presetpower-on action, stopping outputting the electric signal, furthercomprises: if the temperature is lower than the predeterminedtemperature such that the at least one system element does not operateaccording to the preset power-on action, outputting the electric signalto the power supply part, so that the power supply part supplies powerto the heating wire to increase the temperature of the heating wire andthe at least one system element is heated to increase the temperaturethrough the heating wire with temperature which has been increased, andtill that the temperature is higher than the predetermined temperaturesuch that the at least one system element is capable of operatingaccording to the preset power-on action, stopping outputting theelectric signal to the power supply part.
 19. The temperature increasingmethod according to claim 17, wherein the heating module comprises ametal part and a power supply part, the metal part is arranged on the atleast one system element, the power supply part is electricallyconnected to the metal part, and the step of, if the at least one systemelement does not operate according to the preset power-on action,outputting the electric signal to increase the temperature of the atleast one system element, and when the temperature of the at least onesystem element is increased to an extent that the at least one systemelement is capable of operating according to the preset power-on action,stopping outputting the electric signal, further comprises: if thetemperature is lower than the predetermined temperature such that the atleast one system element does not operate according to the presetpower-on action, outputting the electric signal to the power supplypart, so that the power supply part provides current for the metal partto increase the temperature of the metal part and the at least onesystem element is heated to increase the temperature through the metalpart with temperature which has been increased, and till that thetemperature is higher than the predetermined temperature such that theat least one system element is capable of operating according to thepreset power-on action, stopping outputting the electric signal to thepower supply part.
 20. The temperature increasing method according toclaim 19, wherein the power supply part is a fixed-current source andthe current is constant current.